MAYOOKH MITRA
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Recently, alot of new details have surfaced about new SoCs: Apple A16 Bionic and Dimensity 10000. So, lets discuss the details that we got about these SoCs.
Apple A16 Bionic
Apple A16 Bionic is the new SoC in Apple’s self developed SoC range. According to supply chain industry sources, Apple finally completed the design of A16 Bionic SoC. The company is also ready to take advantage of TSMC’s new 4 nm N4P process for production of these SoCs. According to rumors Apple agreed to pay high price for TSMC’s 4 nm process to be ready with enough SoC’s for its iPhone 14 launch.
TSMC will most likely start the mass production of these chips to meet Apple’s timeline of iPhone launch. The A16 Bionic chip will reportedly be installed in iPhone 14 and iPad products.
MediaTek Dimensity 10000
So, lets talk about the MediaTek Dimensity 10000 SoC. MediaTek officially confirmed that it is working on a 3 nm chipset. This chipset will be the successor of Dimensity 9000. This next generation SoC can be the Dimensity 10000 SoC which will be released before the end of 2022.
TSMC’s 3 nm process increased the logic density by 1.7 times and performance increased by 11% compared to the previous generation 5 nm process. This new 3 nm process can reduce the power comsumption by 25 to 30% under same performance.
MediaTek released Dimensity 9000 on 16 December, 2021. However, there are no smartphones which currently use this chipset but many brands have shown interest in this SoC. Industry’s new found focus on Dimensity 9000 SoC can be attributed to the fact this SoC provides slightly better or equal performance when compared to Snapdragon 8 Gen1.
It appears that Dimensity 10000 would be competitor to Qualcomm’s new SoC which is most likely Snapdragon 8 Gen2. Qualcomm is reportedly working with a 4 nm process for its new SoC which makes Dimensity 10000 to appear better.
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